This is a cost-effective micro-focus X-ray inspection system, a professional non-destructive testing device tailored for the precision electronics manufacturing industry. Equipped with a high-resolution imaging system, it can clearly capture micro-defects in BGA, CSP, Flip-chip and QFN packages as well as PCB boards, and perform inspections on IC packages, capacitors, resistors and other electronic components. It supports multi-angle observation and automatic porosity analysis to meet the inspection requirements of various complex packages, delivering an integrated inspection solution featuring high precision, high efficiency and high safety.
The HS-ST-90/130/150 is available with a selectable 90 kV (8 W), 130 kV (60 W) or 150 kV (65 W) micro-focus X-ray source, paired with a 49.5 µm CMOS detector, a rotating swing arm with ±60° tilt and >500X geometric magnification. Sample capacity reaches Φ460×560 mm with an inspection area up to 330×330 mm, so BGA, CSP, Flip Chip, QFN, PCB/PCBA, lithium battery and encapsulation samples are all handled by one cabinet.
| Machine | |
| Dimensions (W×D×H) | 1100 × 1100 × 2100 mm |
| Packing dimensions (W×D×H) | 1300 × 1300 × 2300 mm |
| Weight | approx. 1500 kg |
| Power supply | 380 VAC / 50 Hz |
| X-ray Source | |
| Tube voltage | 90 / 130 / 150 kV (selectable) |
| Maximum output power | 8 W / 60 W / 65 W |
| Tube current | 0.1 – 500 µA |
| Minimum focal spot | ≤ 10 µm |
| Imaging System | |
| Detector type | CMOS flat panel |
| Pixel size | 49.5 µm |
| Pixel matrix | 1172 × 1260 |
| Frame rate | 18 fps |
| Maximum tilt angle | Rotating swing arm ±60° |
| System magnification | > 500X |
| Motion & Capacity | |
| Maximum sample size | Φ460 × 560 mm |
| Maximum inspection area | 330 × 330 mm |
| Software Suite | |
| Navigation | Fast feature-based positioning on the live image |
| Void analysis | Automatic porosity measurement and report export for BGA, QFN and similar packages |
| Metrology tools | Distance, angle, diameter and polygon measurement |
| Image stitching | Stitched full-board views of large PCB / PCBA samples |
| CNC inspection | Single-point and matrix programming with graphic result layout |
PCB / PCBA and SMT assembly inspection · BGA & CSP solder void analysis · QFN and Flip Chip encapsulation check · lithium battery electrode and tab inspection · component authenticity and internal crack detection · university laboratories and R&D prototyping.
Can we sell it under our own brand? Yes — cabinet plate and manuals can be customised on programme orders.
Do you support tender documentation? Specification sheets, CE / ISO certificates, radiation safety data and reference installations are provided for public tenders.
What about service in our region? Remote diagnostics are standard; field engineers can be dispatched, and we train your engineers to handle first-line service locally.
Tell us your market and target annual volume — we will send the dealer price list for the 90 / 130 / 150 kV configurations.